There are varied defects which do not show us the faults like insufficient or immoderate solder, misaligned components, open power pins and marginal joints. In this case we would go for 'Thermal Profiling' as it attributes temperatures in a solder reflow oven at different zones located on top and bottom of the oven. With this we would discover what temperature profile will work best for PCB's complexities and construction.
To solve the problems pertaining to low volume and highly complex assemblies, we acute 'Flying Probe Testing'. This helps us detect the missing components and validate the component placement.
To proceed with the high volume production of mature products, 'ICT Testing' is an apt solution. This will assist us to check the resistance and voltage levels at different nodes of the board by running a power signal. 'ICT Testing' is eminent at detecting parametric failures, PCB design-related faults, and component failures.
To authenticate the board operations and behavior we use 'Functional Testing'. This helps us to detect the faulty or wrong component values, functional and parametric failures.
The strategies adopted for Reliability and Repeatability in our PCB assembly process have fortuned us with reduced production losses, employee safety, process stability, extended equipment life, Reduction in environmental issues and optimum usage of spare parts inventories.