With the miniaturization of electronic devices, the use of thin PCB circuit boards and small components is in vogue. However, the use of thin multi-layer PCBs with small SMT components also brings some issues in its wake. Typically, such PCBs suffer from warpage in the PCB assembly process that impacts among other things, its yield. Besides, excessive warpage also leads to the quality of the paste printing being affected. Warpage also affects the formation of solder joints during the reflow soldering process.
Before we get to the solutions that can help control warpage, let us have a quick understanding of what warpage really is.
Typically, all parts of the Printed Circuit Board should be in contact with the surface. However, sometimes on account of various stresses this does not happen. What we have is a condition where some parts of the PCB bend upwards and some downwards resulting in positive and negative curvature. Sometimes the bend may be along the axes of the board or along the diagonals. The board can sometimes also develop a twist. All these are examples of PCB warpage.
IPC-A-610E standard specifies maximum warpage for incoming PCBs at room temperatures. As per IPC-TM-650, the maximum bow and twist for an SMT PCB must not exceed 0.75%.
To control warpage in PCB assembly, the following steps are recommended:
It is important to go with a PCB contract manufacturer who has a thorough understanding of the various issues that can cause PCB warpage. The above tips can go a long way in ensuring that warpage is kept at acceptable levels.
Technotronix is one of the leading PCB manufacturers in the USA. We have over 4 decades of experience in providing innovative PCB manufacturing services using modern technologies & the latest machinery. We are adhering to strict high-quality standards and compliant with the RoHS (Restrictions of Hazardous Substance) directives. We can fulfil the varied needs of our customers from the simple board to the most complex board for PCB prototype to production.
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