Mastering PCB Mixed Assembly Processing
Our method for rendering mastering mix assembly service commences with Surface Mount Technology (SMT) as a prima phase trending on the heels of Through Hole Technique (THT) for the OEM systems. Apart from SMT and Plated through hole technique we avail many other operations like the implementation of heat sinks, cables and press fit connectors tenable PTH I/0 communications.
The layout stage plays a crucial role in mixed assembly placement. We use Design-For-Manufacture (DFM) progressively for mastering mixed assembly at the time of layout stage. Our core consideration follows factors to get precise mastering mixed placements:
Bring down the total number of parts in a product:
Reduction in parts of a product entails less processing time, development time equipments, assembly difficulty, service inspection, testing etc
We unfold a modular layout:
A modular layout adds versatility to product, streamline in redesigning process and help minimize product variations.
We use multi functional layout parts:
Some layout parts have self aligning features apart from their predominant function that facilitates effective layout modules for mixed assembly placements.
Layout for ease of fabrication:
For ease in mixed assembly process select optimal blend of layout and materials. With the ease in fabrication the problems of excessive tolerance and surface finish requirements will be minimized.
Our master plan is to reduce costs by improving the manufacturability upfront. For this we use varied DFM review process like, Informal "Gut Check review", automated layout automation software (ADA) and Electronic Manufacturing Services (EMS).
We provide advanced PCB prototypes, high and low volume PCB production, mixed assembly placement in addition to component sourcing, layout rework and destructive testing services to our customers worldwide.