BGA Assembly Services

For wide industrial applications like medical devices, industrial automation systems, aerospace electronics, telecommunications equipment, automotive electronics, embedded systems, IoT devices, consumer electronics, miniature electronics manufacturing, computing hardware, and networking equipment, our BGA assembly capabilities include prototype, low-volume, and production-level PCB assembly requirements with a focus on quality, and manufacturing consistency. We support lead-free PCB assembly processes and RoHS-compliant manufacturing requirements for modern electronics production. It requires proper placement, controlled soldering processes, and advanced inspection methods to maintain solder joint reliability and board performance.

Whether you have specific size requirements or intricate designs, we ensure BGA PCB assembly and rework using robust testing methodologies as per industry standards.

Bga Assembly Capabilities

Capability	Standard
Types of BGA PCB:	Micro Ball Grid Array (µBGA) Thin Chip Array Ball Grid Array (CTBGA) Chip Array Ball Grid Array (CABGA) Very Thin Chip Array Ball Grid Array (CVBGA) Very Fine Pitch Ball Grid Array (VFBGA) Land Grid Array (LGA) Chip scale Package (CSP) Wafer level chip scale packaging (WLCSP)
Size:	Available in custom size.
PCB Testing Protocols:	X-ray inspection Functional Testing Automated Optical Inspection
BGA rework:	PCB Reballing Pad and Track Repair BGA Site Modification Correcting Damaged or Missing BGA pads Component removal and replacement

What sets us apart from a BGA assembly service manufacturer?

ISO 9001:2015 and AS 9001 Rev D Certified PCB fabrication company.
Over 45 years of experience, state-of-the-art manufacturing facilities, and best practices.
Supporting high solderability in BGA assembly enhances speed and quality.
Efficient network of component suppliers ensures optimal costs.
Economies of scale for competitive pricing.

FAQs

BGA assembly is a process of mounting ball grid arrays onto a circuit board using solder reflow process. Ball grid arrays are surface mount components which use array of solder balls to make electrical interconnections.

The factors include lamination material compatibility, the warpage requirement, surface finish effect, solder mask clearance, and more.

High density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.

Yes absolutely!

Yes, of course. We conduct a careful DFM (Design for Manufacturability) check to develop an optimized thermal profile.

Yes, absolutely! We are committed to offering a quick turnaround. Although it would depend on your requirement, complexity of products and quantity as well. For any kind of urgent assistance or queries, feel free to contact us.