BGA Assembly

If you are looking at mounting high performance devices, Ball Grid Array (BGA) assembly as it is popularly called, is your answer. A high-density PCB packaging technology, it is extensively used for Integrated Circuits (ICs). On account of its ability to offer high-density packaging with precision component placement, BGA is a popular Surface Mount Packaging that finds use in several electronic components where miniaturization is the order of the day.

At Technotronix, our extensive experience in BGA Assembly services is what has led to clients relying on us for their intricate designs. Irrespective of your size requirements, you can rest assured that we will be able to cater to your bespoke needs. Our robust testing methodologies ensure accuracy of the Ball Grid Array (BGA) Assembly. In addition, you can also count on us for extensive BGA Assembly rework.


Our capabilities in BGA Assembly, span the following:
Capability Standard
Types of BGA PCB:
  • Micro Ball Grid Array (µBGA)
  • Thin Chip Array Ball Grid Array (CTBGA)
  • Chip Array Ball Grid Array (CABGA)
  • Very Thin Chip Array Ball Grid Array (CVBGA)
  • Very Fine Pitch Ball Grid Array (VFBGA)
  • Land Grid Array (LGA)
  • Chip scale Package (CSP)
  • Wafer level chip scale packaging (WLCSP)
BGA Assembly size: We cater to BGA Assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.
BGA PCB testing protocols:
  • X-ray inspection
  • Functional Testing
  • Automated Optical Inspection
BGA rework:
  • PCB Rebelling
  • Pad and Track Repair
  • BGA Site Modification
  • Correcting Damaged or Missing BGA pads
  • Component removal and replacement

With the above services, you can rest assured that your BGA PCBs will be restored to their original performance levels.

Benefits of BGA Printed Circuit Board


Tin Lead Reflow (or Silver) (or Gold) No Silkscreen No Solder mask 23 Preset Drill Sizes up to 200pc PCB prototype

Improved thermal profiles

With low thermal resistance, it ensures that the heat produced is dissipated quickly. In turn, this ensures that the chips aren’t heated.

Improved performance

With low leads, they lend themselves to low lead inductance and hence high electrical performance.

High solderability

This ensures speed of assembly as well as improved quality.

Low chances of damage

With the use of solid solder balls, the probability of damage of the board is significantly reduced, as is the need for maintenance and repair.

Applications of BGA PCB Assembly

Ball Grid Array (BGA) Assembly finds extensive application in a wide variety of applications, including but not limited to:

BGA Assembly

A range of electronic devices such as TVs, mobile phones and more.


Other consumer electronics. Devices that are going miniature are more particularly likely to use it.

BGA Rework

Automotive industry


Military applications

Technotronix Advantage for BGA Assembly

The Technotronix advantage lies in a whole range of aspects, beginning from the fact that we have the proven technology available at our disposal. With over 40 years of experience in a wide range of PCB Fabrication and Assembly techniques, what we also have is trained manpower and importantly, robust industry experience and best practices that you can benefit from.

Our unstinting devotion to quality and customer satisfaction means that once you partner with us, you can rest assured that you will get nothing but the best. The customer-oriented approach also shows up in your commitment to delivery times. With quick turnaround times, you can reap the benefit of quick time-to-market, which, in turn, can be a major source of competitive advantage.

Whether your requirement is BGA PCB design, BGA PCB, BGA PCB layout, BGA Assembly or BGA rework, you can rest assured that you will get superior quality and performance, that will in turn, positively impact the performance of your final product.

With our efficient network of component suppliers and the many economies of scale that we enjoy, that you will get optimal costs, is a given.

Contact us with your bespoke BGA PCB requirements and we will be able to offer you quick custom quotes.

BGA Assembly FAQs

BGA or Ball Grid Array is a high-density PCB packaging technology that is used extensively for Integrated Circuits. With the precision component placement that it offers, it is a popular Surface Mount packaging.

Some of the factors that impact the quality of BGA assembly include checking for the laminate material compatibility, the warpage requirement, surface finish effect, solder mask clearance and more.

Our BGA Printed Circuit Board capabilities span the following:
  • Micro Ball Grid Array (µBGA)
  • Thin Chip Array Ball Grid Array (CTBGA)
  • Chip Array Ball Grid Array (CABGA)
  • Very Thin Chip Array Ball Grid Array (CVBGA)
  • Very Fine Pitch Ball Grid Array (VFBGA)
  • Land Grid Array (LGA)
  • Chip scale Package (CSP)
  • Wafer level chip scale packaging (WLCSP)

High density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.

Yes absolutely! You can count on us for BGA rework services that ensure optimal performance.

We cater to BGA Printed Circuit Board Assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.

For BGA Printed Circuit Board assembly, we have stringent testing protocols including:
  • X-ray inspection
  • Functional Testing
  • Automated Optical Inspection

Yes, of course. We conduct a careful DFM check to develop an optimized thermal profile.

Yes, all you need to do is share your exact BGA assembly requirements at Request Quote Form, and we will review it and get back to you with custom quotes!

Yes, absolutely! We are committed to offering quick turnaround times. Although it would be depending on your requirement, complexity of products and quantity as well. For any kind of urgent assistance or queries, feel free to contact us.
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If you need any custom BGA Printed Circuit Board or BGA assembly for your industrial requirements, You can use BGA PCB Assembly quote request form or BGA PCB Fabrication quote request form and submit information. In case you need BGA PCB fabrication and BGA PCB assembly both, please submit both forms separately. Alternatively, you can email us BOM and Gerber files on or call us on 714/630-9200 in case any other clarification is required in respect to our BGA PCB services.


PCB Assembled in 24 hours

Best Turn around time for Prototype PCB assembly.
Kitted and Turn-Key option as per customers requirement.


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