BGA Assembly

If you are looking at mounting high performance devices in electronics, Ball Grid Array (BGA) assembly is your answer. BGA is a popular high-density and low-cost surface mount packaging that finds use in several electronic components.

At Technotronix, our extensive experience in BGA PCB assembly services led to clients relying on us for their intricate designs. Irrespective of size requirements, you can rest assured that we will be able to cater to your bespoke needs. We ensure accuracy of BGA PCB assembly and rework with robust testing methodologies.


Capability Standard
Types of BGA PCB:
  • Micro Ball Grid Array (µBGA)
  • Thin Chip Array Ball Grid Array (CTBGA)
  • Chip Array Ball Grid Array (CABGA)
  • Very Thin Chip Array Ball Grid Array (CVBGA)
  • Very Fine Pitch Ball Grid Array (VFBGA)
  • Land Grid Array (LGA)
  • Chip scale Package (CSP)
  • Wafer level chip scale packaging (WLCSP)
Size: We cater to BGA assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.
PCB Testing Protocols:
  • X-ray inspection
  • Functional Testing
  • Automated Optical Inspection
BGA rework:
  • PCB Reballing
  • Pad and Track Repair
  • BGA Site Modification
  • Correcting Damaged or Missing BGA pads
  • Component removal and replacement

With the above services, you can rest assured that your BGA PCBs will be restored to their original performance levels.

Benefits of BGA Printed Circuit Board


Tin Lead Reflow (or Silver) (or Gold) No Silkscreen No Solder mask 23 Preset Drill Sizes up to 200pc PCB prototype

Improved thermal profiles

With low thermal resistance, it ensures that the heat produced is dissipated quickly. In turn, this ensures that the chips aren’t heated.

Improved performance

With low leads, they lend themselves to low lead inductance and hence high electrical performance.

High solderability

This ensures speed of assembly as well as improved quality.

Low chances of damage

With the use of solid solder balls, the probability of damage to the board is significantly reduced, as is the need for maintenance and repair.

Applications of BGA PCB Assembly

BGA Assembly

A range of electronic devices such as TVs, mobile phones and more.


Other consumer electronics. Devices that are going miniature are more particularly likely to use it.

BGA Rework

Automotive industry


Military applications


Our advantage lies in an entire range of aspects, beginning with the fact that we have proven technology available at our disposal. With over 40 years of experience in a wide range of PCB fabrication and assembly techniques, well trained team, and best practices; you can get ultimate benefits.

Our commitment to quality and a customer-oriented approach shows our commitment to overall process and delivery in quick turnaround time.

Whether your requirement is BGA PCB design, layout, assembly, or rework; you can rest assured that you will get superior quality and performance which will positively impact the performance of your final product.

With our efficient network of component suppliers and many economies of scale, you will get the optimal costs.

Contact us with your bespoke BGA PCB requirements and we will be able to offer you quick custom quotes.


BGA assembly is a process of mounting ball grid arrays onto a circuit board using solder reflow process. Ball grid arrays are surface mount components which use array of solder balls to make electrical interconnections.

There are some of the factors which impact the quality of BGA assembly; include the laminate material compatibility, the warpage requirement, surface finish effect, solder mask clearance, and more.

Our BGA PCB capabilities span the following:
  • Micro Ball Grid Array (µBGA)
  • Thin Chip Array Ball Grid Array (CTBGA)
  • Chip Array Ball Grid Array (CABGA)
  • Very Thin Chip Array Ball Grid Array (CVBGA)
  • Very Fine Pitch Ball Grid Array (VFBGA)
  • Land Grid Array (LGA)
  • Chip scale Package (CSP)
  • Wafer level chip scale packaging (WLCSP)

High density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.

Yes absolutely! You can count on us for BGA rework services that ensure optimal performance.

Yes, of course. We conduct a careful DFM (Design for Manufacturability) check to develop an optimized thermal profile.

Yes, all you need to do is to share your exact BGA assembly requirements via Request Quote Form, we will review it and get back to you with custom quote!

Yes, absolutely! We are committed to offering a quick turnaround. Although it would depend on your requirement, complexity of products and quantity as well. For any kind of urgent assistance or queries, feel free to contact us.
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If you need any custom BGA PCB or BGA assembly services for your industrial requirements, you can use BGA PCB Assembly quote request form or BGA PCB Fabrication quote request form and submit information. Alternatively, you can email us BOM (Bill of Materials) and Gerber files on or call us on 714/630-9200 in case any other clarification is required.


PCB Assembled in 24 hours

Best Turn around time for Prototype PCB assembly.
Kitted and Turn-Key option as per customers requirement.


To know more about Technotronix
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