BGA Assembly Services

If you are looking at mounting high performance devices in electronics, Ball Grid Array (BGA) assembly is your answer. BGA is a popular high-density and low-cost surface mount packaging that finds use in several electronic components.

At Technotronix, our extensive experience in BGA assembly services led to clients relying on us for their intricate designs. Irrespective of size requirements, you can rest assured that we will be able to cater to your bespoke needs. We ensure accuracy of BGA PCB assembly and rework with robust testing methodologies. We serve various industries including consumer electronics, miniature electronics products manufacturing, automotive, LED, medical, wireless and telecommunication, satellite, and more.

BGA Assembly Quote

BGA ASSEMBLY CAPABILITIES

Capability	Standard
Types of BGA PCB:	Micro Ball Grid Array (µBGA) Thin Chip Array Ball Grid Array (CTBGA) Chip Array Ball Grid Array (CABGA) Very Thin Chip Array Ball Grid Array (CVBGA) Very Fine Pitch Ball Grid Array (VFBGA) Land Grid Array (LGA) Chip scale Package (CSP) Wafer level chip scale packaging (WLCSP)
Size:	Available in custom size.
PCB Testing Protocols:	X-ray inspection Functional Testing Automated Optical Inspection
BGA rework:	PCB Reballing Pad and Track Repair BGA Site Modification Correcting Damaged or Missing BGA pads Component removal and replacement

Ball Grid Array Advantages

Miniaturization in Electronics

There is an increased demand for miniature electronics. In BGA, solder balls offer the appropriate soldering for holding the package to strengthen the interconnection and make it effective.

Improved Performance at High Speed

The placement of solder balls in BGA enables strong interconnections, close bond between components, and reduce warping during high speed. It improves overall electrical performance at high speed.

Reduce Component Damage

The heating process melts the solder balls of ball grid array, that helps in decreasing the chances of component damage.

High solderability

This ensures speed of assembly as well as improved quality.

WHY US?

We have over 44 years of experience, well trained team, and capabilities to provide quality services in quick turnaround.
With our efficient network of components suppliers and many economies of scale, you will get the optimal costs.
We ensure high solderability in BGA assembly manufacturing allows the speed of assembly as well as improved quality.

FAQs

BGA assembly is a process of mounting ball grid arrays onto a circuit board using solder reflow process. Ball grid arrays are surface mount components which use array of solder balls to make electrical interconnections.

The factors include lamination material compatibility, the warpage requirement, surface finish effect, solder mask clearance, and more.

High density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.

Yes absolutely!

Yes, of course. We conduct a careful DFM (Design for Manufacturability) check to develop an optimized thermal profile.

Yes, absolutely! We are committed to offering a quick turnaround. Although it would depend on your requirement, complexity of products and quantity as well. For any kind of urgent assistance or queries, feel free to contact us.

Do you have any BGA assembly requirements? Request a free BGA assembly quote. Alternatively, email BoM, Gerber files, and other required details at sales@technotronix.us or call us 714/630-9200.