If you are looking at mounting high performance devices, Ball Grid Array (BGA) assembly as it is popularly called, is your answer. A high-density PCB packaging technology, it is extensively used for Integrated Circuits (ICs). On account of its ability to offer high-density packaging with precision component placement, BGA is a popular Surface Mount Packaging that finds use in several electronic components where miniaturization is the order of the day.
At Technotronix, our extensive experience in BGA Assembly services is what has led to clients relying on us for their intricate designs. Irrespective of your size requirements, you can rest assured that we will be able to cater to your bespoke needs. Our robust testing methodologies ensure accuracy of the Ball Grid Array (BGA) Assembly. In addition, you can also count on us for extensive BGA Assembly rework.
BGA ASSEMBLY CAPABILITIES
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|BGA Assembly size:||We cater to BGA Assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.|
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With the above services, you can rest assured that your BGA PCBs will be restored to their original performance levels.
Benefits of BGA Printed Circuit Board
Tin Lead Reflow (or Silver) (or Gold) No Silkscreen No Solder mask 23 Preset Drill Sizes up to 200pc PCB prototype
With low thermal resistance, it ensures that the heat produced is dissipated quickly. In turn, this ensures that the chips aren’t heated.
With low leads, they lend themselves to low lead inductance and hence high electrical performance.
This ensures speed of assembly as well as improved quality.
With the use of solid solder balls, the probability of damage of the board is significantly reduced, as is the need for maintenance and repair.
Applications of BGA PCB Assembly
Ball Grid Array (BGA) Assembly finds extensive application in a wide variety of applications, including but not limited to:
A range of electronic devices such as TVs, mobile phones and more.
Other consumer electronics. Devices that are going miniature are more particularly likely to use it.
Technotronix Advantage for BGA Assembly
The Technotronix advantage lies in a whole range of aspects, beginning from the fact that we have the proven technology available at our disposal. With over 40 years of experience in a wide range of PCB Fabrication and Assembly techniques, what we also have is trained manpower and importantly, robust industry experience and best practices that you can benefit from.
Our unstinting devotion to quality and customer satisfaction means that once you partner with us, you can rest assured that you will get nothing but the best. The customer-oriented approach also shows up in your commitment to delivery times. With quick turnaround times, you can reap the benefit of quick time-to-market, which, in turn, can be a major source of competitive advantage.
Whether your requirement is BGA PCB design, BGA PCB, BGA PCB layout, BGA Assembly or BGA rework, you can rest assured that you will get superior quality and performance, that will in turn, positively impact the performance of your final product.
With our efficient network of component suppliers and the many economies of scale that we enjoy, that you will get optimal costs, is a given.
Contact us with your bespoke BGA PCB requirements and we will be able to offer you quick custom quotes.
BGA Assembly FAQs
- Micro Ball Grid Array (µBGA)
- Thin Chip Array Ball Grid Array (CTBGA)
- Chip Array Ball Grid Array (CABGA)
- Very Thin Chip Array Ball Grid Array (CVBGA)
- Very Fine Pitch Ball Grid Array (VFBGA)
- Land Grid Array (LGA)
- Chip scale Package (CSP)
- Wafer level chip scale packaging (WLCSP)
- X-ray inspection
- Functional Testing
- Automated Optical Inspection