If you are looking at mounting high performance devices in electronics, Ball Grid Array (BGA) assembly is your answer. BGA is a popular high-density and low-cost surface mount packaging that finds use in several electronic components.
At Technotronix, our extensive experience in BGA PCB assembly services led to clients relying on us for their intricate designs. Irrespective of size requirements, you can rest assured that we will be able to cater to your bespoke needs. We ensure accuracy of BGA PCB assembly and rework with robust testing methodologies.
BGA ASSEMBLY CAPABILITIES
|Types of BGA PCB:||
|Size:||We cater to BGA assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.|
|PCB Testing Protocols:||
With the above services, you can rest assured that your BGA PCBs will be restored to their original performance levels.
Benefits of BGA Printed Circuit Board
Tin Lead Reflow (or Silver) (or Gold) No Silkscreen No Solder mask 23 Preset Drill Sizes up to 200pc PCB prototype
With low thermal resistance, it ensures that the heat produced is dissipated quickly. In turn, this ensures that the chips aren’t heated.
With low leads, they lend themselves to low lead inductance and hence high electrical performance.
This ensures speed of assembly as well as improved quality.
With the use of solid solder balls, the probability of damage to the board is significantly reduced, as is the need for maintenance and repair.
Applications of BGA PCB Assembly
A range of electronic devices such as TVs, mobile phones and more.
Other consumer electronics. Devices that are going miniature are more particularly likely to use it.
Our advantage lies in an entire range of aspects, beginning with the fact that we have proven technology available at our disposal. With over 40 years of experience in a wide range of PCB fabrication and assembly techniques, well trained team, and best practices; you can get ultimate benefits.
Our commitment to quality and a customer-oriented approach shows our commitment to overall process and delivery in quick turnaround time.
Whether your requirement is BGA PCB design, layout, assembly, or rework; you can rest assured that you will get superior quality and performance which will positively impact the performance of your final product.
With our efficient network of component suppliers and many economies of scale, you will get the optimal costs.
Contact us with your bespoke BGA PCB requirements and we will be able to offer you quick custom quotes.
- Micro Ball Grid Array (µBGA)
- Thin Chip Array Ball Grid Array (CTBGA)
- Chip Array Ball Grid Array (CABGA)
- Very Thin Chip Array Ball Grid Array (CVBGA)
- Very Fine Pitch Ball Grid Array (VFBGA)
- Land Grid Array (LGA)
- Chip scale Package (CSP)
- Wafer level chip scale packaging (WLCSP)