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Reach out sales@technotronix.us to send Bill of Materials (BoM), Gerber files, and other necessary details.
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ISO 9001:2015 | AS9100 Rev. D Certified | IPC-A-610 CLASS 1-2-3 | J Std 001E Class I, II, and III
From early-stage prototypes to full production runs, PCB assembly capabilities support a wide range of electronic applications and industry requirements. Experience spans complex, custom circuit board assemblies with blind, buried, and micro vias, as well as advanced layout and manufacturing requirements. Whether the project involves design evaluation, cost optimization, or custom solutions are tailored to meet specific technical and business objectives.
| Capability | Standard |
|---|---|
| Assembly Types: | Surface mount (SMT), Single & double-sided SMT/PTH, Mixed Technology, Large parts on both sides |
| Solder Types: | Leaded, ROHS compliant |
| PCB Types: | Single-sided PCBs, Double-sided PCBs, multi-layer PCBs |
| Board Type: | Rigid, Metalcore, Flexible Rigid-Flex |
| Alter/Rework: | Ball Grid Array replacement station, IR rework station |
| Quality Checking: | AOI checking, Visual inspection, BGA Placement- X-Ray checking |
| Parts Procurement: | Turnkey, Biased Turnkey, Kitted/ Consigned |
| Components: | Passive components, Connectors, Terminals |
| Stencils: | Nano-coating, Laser-cut stainless steel |
| Lead Times: | 1-2 weeks,4-7 days and Scheduled deliveries |
| Volume: | Engineering prototype |
In this process, holes are made into PCBs. Pin-through-hole components are inserted into it by soldering.
These include the following steps:
Step 1 : Check the client's circuit board design documents and accordingly organize and fix all the components.
Step 2 : Checking and rectification. Plug boards and components together.
Step 3 : Wave soldering is done at a high temperature and by moving the circuit boards in the liquid solder via waving.
Using solder paste, components are placed in circuit boards.
The following steps are needed in SMT:
Step 1 : A solder paste printer is required to solder paste on components and boards. Use stencil to ensure it is done properly or not.
Step 2 : PCBs are sent to the pick and place machine automatically for mounting components and integrated circuits on the pads with the solder paste effect. After that, the component reels are required for the installation of components onto the PCB boards.
Step 3 : Reflow soldering is done at high temperatures. Circuit boards are placed in an approx. 22-foot-long furnace.
All these procedures like printing using solder paste, placement of SMD parts, reflow soldering, wave soldering, and placement via through hole technology are necessary to do.
For the best results, there are a few procedures that must be followed like surface mount adhesive, SMD parts placement, flipping, solidification, wave soldering, and PTH placement.
In the double-sided mixed PCB assembly, it is processed in both ways with or without adhesive. Surface mount adhesive is an optional step based on requirement. All other steps of single side and between the two sides are used.
Download the Comprehensive Guide for Printed Circuit Board Assembly Process!
Reach out sales@technotronix.us to send Bill of Materials (BoM), Gerber files, and other necessary details.
Request a free quote!Please provide your email address. We’ll send you copy of our brochure in a PDF format.