The trend of utilizing electronic products is the motivation to produce more technical creations. As the ages become advanced, electronic innovation also gets smarter with time. From households to rockets technology in every possible field, electronic devices are spreading their demands.
And as the demand graph is getting peak, competition in the market is getting neck to neck. Any traditional mass production cannot be enough to beat the opponent. Highly skillful, advanced-level service only has to provide room for your company in this market.
This is not an easy operation to become outstanding in the market. From material selection to design in every aspect, you have to put extra care to make it unique from the market. Great quality of PCB manufacturing techniques is the heart of your best PCB Assembly foundation.
What is sequential lamination PCB?
Production fabrication is the process of rearranging a circuit board to a bodily configuration of PCB based on how the client demand. Sequential lamination is one of the steps of technical lamination.
Sequential is the method of adding a copper or some specific metal layer. For the best results, every PCB board is going through a minimum of two lamination processes or more than that.
Traditional circuit board sequential lamination
Nowadays, multilayer PCB used most of the time. This type of board is tinier in size. The component also used in the time of manufacturing concise the density of the product. In a simple word, multiple layers of circuit boards make Assembly manageable to use flexibly.
Simultaneously, PCB’s stuck-up design is a single-layer circuit board that needed some convenient fabrication. By knowing the manufacturing competence well, it will be easy to do that.
Sequential lamination is a common step in the PCB fabrication process. The process is described below –
Sequential lamination’s success rate in multiple-layer boards is very high. Especially in high-density electronic technology, it is more fruitful. Here it’s the main function to maintain high signal messages like communication.
Some challenges sequential lamination has to face
The whole process of lamination is not that easy, and it seems it has to phase multiple challenges in its procedure. Like –
Limitations in the number of cycles
As said previously, for the favorable results of lamination, more than two cycling required. But that doesn’t mean it accomplished in whatever times you want. Cycling has to be restricted two-four times to prevent defect to the Assembly.
For the drill holes equipment, other factors that have to be concerned with are the aspect ratios. Aspects ratio is the measurement of depth in the aspect of the diameter of the drill hole.
Based on what type of equipment is used in bore vias to like – beams drill or drill press, the ratio is varied, and according to it, the calculations are done. The aspect ratio limited the layer used in multiple layers circuits for different calculations.
Drill hole alignment in case of Garber file
Gerber is a 2D file commonly used in PCB designing. Designers like the Garber file because of its generating power of software in PCB Circuit.
But there are some problems during the Gerber file’s lamination, as there is a huge chance of mistake in the fabrication of the circuit board. That causes misalignment of the circuit. This type of error increases the overall cost of the circuit and the time of reversal.
Sequential lamination is a spontaneous building process that requires several days to build the desired board. So, the more time it consumes to develop the circuit, the more expenses gradually increase with it.
Despite all these limitations, it is one of the best processes of fabrication in PCB circuit boards. It is very useful because it minimizes the circuit’s layer and can maintain the temperature with environmental changes. Not only that, it reduces the weight of the copper layer. Sequential lamination cut down the need for buried vias or blind via which is also one of the plus points of this lamination.
So, if it is possible to neglect the shortcomings of this lamination, it will be a blessing to the technology of PCB.
Trends for sequential lamination:
- Number of layers reduce in a noticeable extent by using sequential lamination.
- Make the PCB so that it can handle easily.
- The structure of the board gets simplified.
Technique for sequential Lamination PCB:
The above mentioned are some weaknesses of lamination techniques. Now in this passage, we discussed the technique we have to use for the best results of sequential lamination.
- The cause of all this deformity is the many layers used in PCB. Big numbers of layers reduce the potential of the PCB. So, if the number of layers used is decreased, it will be a fair solution to the problems.
- To minimize the number of layers, some embedded elements can be put in to layers. By this method, apart from the top and bottom layers, only a few layers are required.
- Proper alignment of the components used in the board, which is connected by each. Passive components need to use more in number to delete the drawback. And the active components are used to try to embed them in between layers of the circuit.
- Another solution is using a 3D device instead of 2D. The more advanced technology of 3D helps to cope with the consequences of lamination.
- Turnkey PCB assembly is an incredible remedy to all problems. Turnkey PCB Assembly will handle every problem by its organized management.
- From manufacturing, maintaining, stoking to delivering every aspect are rectified by Turnkey’s advanced technology. And Turnkey PCB is also very reliable and safe. You can trust on its work efficiency.
The commitment of the sequential lamination is very straightforward. It furnishes PCB multiple-layer stack up, which gives security to your precious documents. PCB Lamination techniques will be a good option for circuit designing. So, if you want an up-to-date, ready to use, modern PCB assembly circuit, definitely go for sequential Lamination PCB.
At Technotronix, we have over 4 decades of experience in PCB fabrication. You can rely on our PCB design and fabrication process that, in turn, lead to that perfect PCB fabrication. An improper design can lead to a wide variety of issues such as imbalance. We provide you products at an affordable price, including testing services. If you require any kind of printed circuit board fabrication, conformal coating, NPI, circuit board prototype services, you can drop an email to firstname.lastname@example.org or give us a call at 714/630-9200.